To provide an electric contact electrode, an electric contact film, and a conductive filler using a new composite material that has a sufficiently long sliding life in an electric contact point using a low-cost metal; and to achieve a low-cost electric contact structure in which a life of the electric contact in an electric apparatus is sufficiently long.
A reducing agent is mixed with a plating bath that includes a metal salt as primary component to be dissolved or be in a colloidal state, and a complexing agent is added to the plating bath as needed. A plated member is electroplated by using the resultant plating bath so as to obtain the composite material through a composite plating method that forms eutectoid of a matrix metal and the reducing agent. In the composite material, a reducing agent is dispersed in the metal matrix and can reduce an oxide of the metal at room temperature.
| JP2005120425A | 2005-05-12 | |||
| JP2002146585A | 2002-05-22 | |||
| JP2000273684A | 2000-10-03 | |||
| JP2003342621A | 2003-12-03 |
Takashi Ishida
Tetsuji Koga
Manabu Saito
Nakamura Asayuki
Nagasaka Tomoyasu