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Patent Searching and Data


Title:
COMPOSITE MATERIAL AND ITS PRODUCTION
Document Type and Number:
Japanese Patent JPH1017959
Kind Code:
A
Abstract:

To obtain a material having excellent properties such as a small thermal expansion coefficient by dispersing a shape memory alloy into Al, an Al alloy, Cu or a Cu alloy.

This composite material is the one in which a shape memory allay such as a Cu-Al-Mn alloy having a granular or a fibrous shape is dispersed into Al, an Al alloy, Cu or a Cu alloy which is a metal having high thermal conductivity as a matrix. The boundary between the matrix and the dispersing agent is bonded by micrometallic bond, and this shape memory alloy is applied with prestrains to a degree in which superelasticity is not damaged. As for this material, compressive stress is generated in the shape memory alloy by the increase of the temp. in the use to reduce the thermal expansion coefficient on the whole body of the composite material. After the application of the prestrains, restoring treatment is executed according to necessity. Furthermore, since both the matrix and shape memory alloy forming the composite material are excellent in thermal conductivity and workability, are also lightweight and inexpensive, it is suitably used for heat sinks, substrates or the like for electronic equipment placed with semiconductors or the like.


Inventors:
Ninomiya, Junji
Suzuki, Takuya
Hideno, Akira
Application Number:
JP1996000173554
Publication Date:
January 20, 1998
Filing Date:
July 03, 1996
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD:THE
International Classes:
C22C49/00; C22C9/00; C22C19/03; C22C21/00; C22C47/00; C22C49/06; (IPC1-7): C22C1/09; C22C9/00; C22C19/03; C22C21/00