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Title:
COMPOSITE MATERIAL WITH HIGH THERMAL-CONDUCTIVITY AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2010236016
Kind Code:
A
Abstract:

To reduce a manufacturing cost of a composite material with high thermal-conductivity, which is formed by combining a sintered plate of an aluminum powder with a fibrous carbon material, by reducing the amount of the fibrous carbon material to be used therein while securing a high mechanical strength so as to be used for a thermal diffusion plate for cooling an element, which serves as an element mounting portion, and also maintaining superior thermal conductivity.

This composite material includes: a tabular base metal 22 which is formed of pure aluminum or an aluminum alloy; and a tabular high-thermal-conductivity portion 23 which is buried in a middle part in the plate thickness direction of the tabular base metal 22 and in a part of planar regions perpendicular to the plate thickness direction. The tabular high-thermal-conductivity portion 23 is a stacked body of: a sintered compact layer of an aluminum powder; and a fiber-oriented sheet in which a fibrous carbon material is oriented in a specific one direction parallel to the surface of the sheet. This manufacturing method includes sintering the aluminum powder by using a powdery sheet which uses a binder therein, on a part of the surface of an aluminum powder layer of a stacked body before being sintered, which becomes the tabular high-thermal-conductivity portion 23, and using a tabular bulk body of aluminum on the top layer of the aluminum powder layer before being sintered, which becomes the tabular base metal 22.

COPYRIGHT: (C)2011,JPO&INPIT


Inventors:
KATAGIRI KAZUAKI
IMANISHI TERUMITSU
SHIMIZU AKIYUKI
SATO YASUHIKO
KAKITSUJI ATSUSHI
Application Number:
JP2009085011A
Publication Date:
October 21, 2010
Filing Date:
March 31, 2009
Export Citation:
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Assignee:
SUMITOMO PRECISION PROD CO
OSAKA PREFECTURE
International Classes:
C22C49/14; B22F7/06; B22F7/08; C22C47/06; C22C47/14; C22C49/06; D01F9/127; H01L23/373; B22F3/14; C22C101/10
Domestic Patent References:
JPH08503023A1996-04-02
JP2009013475A2009-01-22
JPH07269312A1995-10-17
Attorney, Agent or Firm:
Takahiko Yanagita