Title:
COMPOSITE MATERIAL WITH HIGH THERMAL CONDUCTIVITY
Document Type and Number:
Japanese Patent JP2012255086
Kind Code:
A
Abstract:
To provide a composite material that can exhibit high thermal conductivity even if the volume content of inorganic material particles is made large.
The composite material with high thermal conductivity is provided which comprises a resin material 1 and the inorganic material particles 2 dispersed in the resin material 1, wherein the interface of the resin material 1 and the inorganic material particles 2 includes an organic polymer layer 3 inside which the molecular sequence thereof is ordered.
Inventors:
SATO KIMIYASU
IJUIN ATSUKO
HOTTA YUJI
IJUIN ATSUKO
HOTTA YUJI
Application Number:
JP2011128867A
Publication Date:
December 27, 2012
Filing Date:
June 09, 2011
Export Citation:
Assignee:
AIST
International Classes:
C08L101/00; C08K9/04
Domestic Patent References:
| JP2005298708A | 2005-10-27 | |||
| JP2008189814A | 2008-08-21 | |||
| JP2008255186A | 2008-10-23 | |||
| JP2009235402A | 2009-10-15 | |||
| JP2008502779A | 2008-01-31 |
Attorney, Agent or Firm:
Ippei Watanabe
Koji Kikawa
Hiroyuki Sato
Shigeru Koike
Koji Kikawa
Hiroyuki Sato
Shigeru Koike