Title:
複合材料
Document Type and Number:
Japanese Patent JP4986725
Kind Code:
B2
Abstract:
A composite material obtained by laminating (A) a layer formed from an epoxy resin curing composition and (B) a layer of a polyimide to each other. The composite material is preferably obtained by applying the epoxy resin curing composition to at least one side of a polyimide film or sheet. The epoxy resin curing composition includes a curing agent containing a polyamide compound having a repeat unit comprising a phenolic hydroxyl group containing structure represented by the following formula (I) or (II): In formula (I), ring A and R each represent a phenylene group or a naphthylene group, each of which may be substituted with a halogen atom, a hydroxyl group or an alkyl group having 1 to 4 carbon atoms. In formula (II), ring B is an arylene group having 6 to 18 carbon atoms or an alkylidenediarylene group having 13 to 25 carbon atoms, each of which may be substituted with a halogen atom, a hydroxyl group or an alkyl group having 1 to 4 carbon atoms.
Inventors:
Takahiro Mori
Yoshihiro Fukuda
Yoshinori Takahata
Yoshihiro Fukuda
Yoshinori Takahata
Application Number:
JP2007156893A
Publication Date:
July 25, 2012
Filing Date:
June 13, 2007
Export Citation:
Assignee:
ADEKA CORPORATION
International Classes:
B32B27/34; B32B27/38; C08G59/62; C08K5/5399; C08K7/18; C08L63/00; H05K1/03
Domestic Patent References:
| JP9176485A |
Foreign References:
| WO2006129480A1 |
Attorney, Agent or Firm:
Osamu Hatori