To provide: a composite member superior in adhesion with solder; a heat radiation member comprising the composite members; a semiconductor device including the heat radiation member; and a method of manufacturing the composite member.
A composite member 1 includes a substrate 20 made of a composite material in which magnesium or magnesium alloy is combined with SiC, and a metal covered layer 10 having multilayer structure that is formed on the surface of the substrate 20. The metal covered layer 10 includes, in order from the side of the substrate 20: an underlayer 11 having the same composition as a matrix metal of the substrate 20; a zinc layer 12 formed by zincate treatment; a copper plating layer 13; and a nickel plating layer 14. The copper plating layer 13 is comparatively thick, exceeding 1 μm in thickness. Due to such a structure, peeling strength between the composite member 1 and solder is high, and semiconductor elements or the like are hard to be peeled off from the composite member 1 when they are bonded thereto.
NISHIKAWA TAICHIRO
IKEDA TOSHIYA
KOYAMA SHIGEKI
ALLIED MATERIAL CORP