Title:
COMPOSITE METAL LAMINATE FOR SEMICONDUCTOR MOUNTING BOARD
Document Type and Number:
Japanese Patent JPH04274383
Kind Code:
A
Abstract:
PURPOSE: To provide a material for a semiconductor mounting board having excellent matching properties to thermal expansion coefficient of an opponent adhesive material and easy in forming an insulating layer having excellent thermal conductivity and adhesive strength.
CONSTITUTION: An aluminum layer 2 is laminated on both or one side of a copper/Invar alloy/copper clad material 1, and formation of an insulating layer by forming alumite is facilitated while utilizing features of the clad material.
Inventors:
HIRANO KENJI
Application Number:
JP5967791A
Publication Date:
September 30, 1992
Filing Date:
February 28, 1991
Export Citation:
Assignee:
SUMITOMO SPEC METALS
International Classes:
C23C30/00; H01L23/14; H01L23/373; H05K1/05; (IPC1-7): C23C30/00; H01L23/14; H05K1/05
Domestic Patent References:
| JPS5668870A | 1981-06-09 | |||
| JPS6081645A | 1985-05-09 | |||
| JPH01308527A | 1989-12-13 | |||
| JPH02207401A | 1990-08-17 | |||
| JPH03135276A | 1991-06-10 |
Attorney, Agent or Firm:
Yoshihisa Oshida