Title:
COMPOSITE PLATING METHOD BY ELECTROLESS PLATING
Document Type and Number:
Japanese Patent JP3167456
Kind Code:
B2
Abstract:
PURPOSE: To form a composite plating layer in which a fluororesin is uniformly dispersed at a high deposition rate by executing an electroless plating treatment using a specific cyanide plating bath, thereby forming a gold plating layer dispersedly contg. the fluororesin.
CONSTITUTION: The electroless plating treatment is executed by using the self- catalyst thick deposition type electroless gold cyanide plating bath having ≤150g/l concn. of a conductive salt added with the fine fluororesin and ≤20g/l concn. of a gold salt as gold. The gold plating layer dispersedly contg. the fluororesin is formed in such a manner. DM, AB or boron hydride compd. and thiourea, etc., are used as a reducing agent in the gold plating bath. As a result, the composite plating layer uniformly dispersing the fluororesin in the gold matrix is formed.
Inventors:
Yuji Yanagida
Yasuhiko Iwaki
Yasuhiko Iwaki
Application Number:
JP28100392A
Publication Date:
May 21, 2001
Filing Date:
September 25, 1992
Export Citation:
Assignee:
Sanno Co., Ltd.
International Classes:
C23C18/52; (IPC1-7): C23C18/52
Attorney, Agent or Firm:
Yoshiteru Oshida
Previous Patent: 耳栓付きマグネチック型イヤホーンマイクロホン
Next Patent: APPARATUS FOR INSPECTING ABNORMALITY IN PACKAGED BODY
Next Patent: APPARATUS FOR INSPECTING ABNORMALITY IN PACKAGED BODY