Title:
COMPOSITE PLATING METHOD
Document Type and Number:
Japanese Patent JP3391113
Kind Code:
B2
Abstract:
PURPOSE: To simplify equipment and to improve workability by easily and surely controlling the codeposition quantity of insoluble particles into a metallic matrix in a thickness direction at the time of composite plating.
CONSTITUTION: A base material 1 is placed on a stage 14 and a power source 16 is turned on to operate a pump 18. Initially, a composite plating liquid passes a communicating path 17 and is ejected vigorously from a jet nozzle 15. The plating liquid collides against the front surface of the base material 1. At this time, the jet nozzle 15 plays the role of anode and the base material 1 as cathode. The metallic matrix is formed on the front surface of the base material 1 and since the flow velocity of the composite plating liquid is initially relatively high, the insoluble particles in the metallic matrix do not substantially exist any more. Thereafter, the ejecting quantity of composite plating liquid is gradually decreased. The quantity of the insoluble particles in the metallic matrix 3 to be gradually deposited and formed increases gradually and the codeposition of the insoluble particles is relatively large on the outer layer side.
Inventors:
Hiromitsu Takeuchi
Masahiro Okumiya
Yoshiki Tsunekawa
Masahiro Okumiya
Yoshiki Tsunekawa
Application Number:
JP24439394A
Publication Date:
March 31, 2003
Filing Date:
October 07, 1994
Export Citation:
Assignee:
Toyoda Gosei Co., Ltd.
International Classes:
C23C18/52; C23C24/04; C25D5/08; C25D5/44; C25D15/02; (IPC1-7): C25D15/02; C23C18/52
Domestic Patent References:
| JP4914613B1 |
Attorney, Agent or Firm:
Hironobu Onda