To provide a method for producing a composite plating solution, capable of stably dispersing SiC particles.

A method for producing an SiC particle dispersed composite plating solution by an electroless or electrolytic method, includes: a step of causing a cationic surfactant, such as an alkylamine salt and an amino alcohol fatty acid derivative, to adsorb to an SiC particle that is cleaned by water, an organic solvent and the like and purified by acid, such as a sulfuric acid, a nitric acid and a hydrochloric acid, and an acid solution mixed therewith; and a step of dispersing the SiC particle to which the cationic surfactant has been adsorbed, into a plating solution.