PURPOSE: To resist even high differential pressure and pressure sufficiently, to obtain a uniform high output and to enable the measurement of differential pressure and pressure with high accuracy by constituting the pressure sensitive diaphragm of a composite function type differential pressure and pressure sensor as a pressure sensitive diaphragm having different plate thickness.

CONSTITUTION: A semiconductor differential pressure and pressure sensor chip 1 is composed of two thin sections 11, 13 (pressure sensitive diaphragms in general) having different plate thickness and a thick section 12. There are resistor groups 111-114 formed by a diffusion on the pressure sensitive diaphragms 11, 13 while the same resistor groups 121-124 and 131 are also shaped to the thick section. Hermetic seal terminals 41, 42 for extracting an electric signal from the semiconductor differential pressure and pressure sensor chip 1 to the outside are mounted to a cylindrical body 4. Resistance against higher differential pressure and pressure is obtained by making the pressure sensitive diaphragm 13 on the inside thicker than the pressure sensitive diaphragm 11 on the outside, and an output is increased and the change of resistance is equalized by the pressure sensitive diaphragm on the outside.