Title:
複合構造体、それを用いた包装材料および成形品、ならびに、それらの製造方法およびコーティング液
Document Type and Number:
Japanese Patent JP5840694
Kind Code:
B2
Abstract:
A composite structure disclosed includes a base (X) and a layer (Y). The layer (Y) includes a mixture of a metal oxide (A), a phosphorus compound (B), and a compound (L a ) (silicon compound). Examples of the phosphorus compound (B) and the compound (L a ) include a compound containing a site capable of reacting with the metal oxide (A). When the number of moles of metal atoms (M) derived from the metal oxide (A) is denoted by N M and the number of moles of Si atoms derived from the compound (L a ) is denoted by N Si , 0.01 ¤ N Si /N M ¤ 0.30 is satisfied. When the number of moles of phosphorus atoms derived from the phosphorus compound (B) is denoted by Np, 0.8 ¤ N M /N P ¤ 4.5 is satisfied.
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Inventors:
Ryoichi Sasaki
Kentaro Yoshida
Mamoru Omota
Hirose Wataru
Manabu Shibata
Tatsuya Onoshita
Kentaro Yoshida
Mamoru Omota
Hirose Wataru
Manabu Shibata
Tatsuya Onoshita
Application Number:
JP2013537428A
Publication Date:
January 06, 2016
Filing Date:
October 05, 2012
Export Citation:
Assignee:
KURARAY CO.,LTD.
International Classes:
B32B9/00; B65D30/02; B65D65/40; B65D81/24; C09D7/12; C09D129/04; C09D183/02; C09D183/04; C09D185/00; C09D201/00; C09D201/02; C09D201/08
Domestic Patent References:
JP2007523769A | ||||
JP2003508627A | ||||
JP4961054B2 | ||||
JP2002503387A |
Foreign References:
WO2009125800A1 |
Attorney, Agent or Firm:
Koichi Kamata