Title:
COMPOSITE STRUCTURE AND SEMICONDUCTOR MANUFACTURING EQUIPMENT WITH COMPOSITE STRUCTURE
Document Type and Number:
Japanese Patent JP2022169531
Kind Code:
A
Abstract:
To provide a composite structure used as a component for semiconductor manufacturing equipment and the semiconductor manufacturing equipment having the composite structure, which can increase low-particle generation.SOLUTION: A composite structure includes a base material and a structure provided on the base material and having a surface. The structure contains Y3Al5O12 as a main component and its indentation hardness is greater than 8.5 GPa. The structure has excellent low-particle generation and is preferably used as a component for semiconductor manufacturing equipment.SELECTED DRAWING: Figure 5
Inventors:
Hiroaki Ashizawa
Akito Takizawa
Akito Takizawa
Application Number:
JP2022119989A
Publication Date:
November 09, 2022
Filing Date:
July 27, 2022
Export Citation:
Assignee:
TOTO Ltd.
International Classes:
H01L21/3065; C23C14/08; C23C24/04; H01L21/31
Attorney, Agent or Firm:
Akio Konno
Inami Minoru
Takeyasu Ito
Riyuki Yoshino
Yoshimura Tamura
Inami Minoru
Takeyasu Ito
Riyuki Yoshino
Yoshimura Tamura
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