Title:
複合基板および複合基板の製造方法
Document Type and Number:
Japanese Patent JP6549054
Kind Code:
B2
Abstract:
Provided are a composite substrate and a method of manufacturing a composite substrate with which sufficient bonding strength can be acquired in bonding of a piezoelectric material layer and a support substrate. The present invention is characterized by being a composite substrate including; a single crystal support substrate containing a first element as a main component; an oxide single crystal layer provided on the single crystal support substrate and containing a second element (excluding oxygen) as a main component; and an amorphous layer provided in between the single crystal support substrate and the oxide single crystal layer and containing a first element, a second element, and Ar, the amorphous layer having a first amorphous region in which proportion of the first element is higher than proportion of the second element, and a second amorphous region in which the proportion of the second element is higher than the proportion of the first element, concentration of Ar contained in the first amorphous region being higher than concentration of Ar contained in the second amorphous region and being 3 atom% or more.
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Inventors:
Masatsugu Akiyama
Masayuki Tanno
Masayuki Tanno
Application Number:
JP2016043992A
Publication Date:
July 24, 2019
Filing Date:
March 08, 2016
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
H03H9/25; H01L21/02; H03H3/08
Domestic Patent References:
| JP3187231U | ||||
| JP2005252550A |
Foreign References:
| WO2014077213A1 |
Attorney, Agent or Firm:
Shigeki Orizaka