Title:
放電加工用の複合材ワイヤ
Document Type and Number:
Japanese Patent JP5069134
Kind Code:
B2
Abstract:
The invention relates to a wire (1) which comprises a copper or pinchbeck core (2) surrounded by a pinchbeck coating consisting of a continuous pinchbeck sub-layer (3) in phase β and a superficial layer (4) with a fractured pinchbeck structure in phase ? enabling the appearance of pinchbeck in phase β in the fractures (5a). In this way, the electrical discharge machining speed is essentially increased.
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Inventors:
Blanc, Patrick
Lilly, Michelle
Sanche, Gerard
Lilly, Michelle
Sanche, Gerard
Application Number:
JP2007554600A
Publication Date:
November 07, 2012
Filing Date:
February 10, 2006
Export Citation:
Assignee:
THERMOCOMPACT
International Classes:
B23H7/08; B21C1/00; C22C9/04; C22F1/08; C23C10/28; C25D5/50; C25D7/06; C22F1/00
Domestic Patent References:
| JP2002126949A | ||||
| JP2003291030A |
Attorney, Agent or Firm:
Tadahiko Ito
Shinsuke Onuki
Tadashige Ito
Koichi Matsumoto
Shinsuke Onuki
Tadashige Ito
Koichi Matsumoto