Title:
COMPOSITE WOODY MATERIAL FOR BUILDING
Document Type and Number:
Japanese Patent JP3803168
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To hold necessary mechanical strength with high dimensional stability by laminating at least two or more of first base materials obtained by dimensionally stabilizing a woody material by heat steam treating and second base materials not dimensionally stabilized.
SOLUTION: First base materials B obtained by dimensionally stabilizing a woody material by heat steam treating and second base materials C not dimensionally stabilized are alternately laminated and adhered. Raw material of the material B is arbitrary woody material used as a base material or surface material for a decorative plate of a woody working material having relative scarcity of dimensional stability like solid sawn plate, plywood, timer thin plate or particle board. Raw material of the material C is material containing resin as a base like woody material or FRP of solid sawn plate, timer thin plate, plywood exhibiting high resistance against bending or compressiond. The materials B and C are alternately laminated and adhered to provide high dimensional stability and predetermined mechanical strength.
Inventors:
Jiro Nishio
Takashi Kimura
Yukari Seto
Tatsushi Miyata
Takashi Kimura
Yukari Seto
Tatsushi Miyata
Application Number:
JP14960197A
Publication Date:
August 02, 2006
Filing Date:
June 06, 1997
Export Citation:
Assignee:
Yongdai Sangyo Co., Ltd.
International Classes:
B27D1/04; B27K5/00; B27M3/00; E04C2/12; E04F11/02; E04F15/04; (IPC1-7): B27D1/04; B27K5/00; B27M3/00; E04C2/12; E04F11/02; E04F15/04
Domestic Patent References:
| JP7227807A | ||||
| JP55009345U | ||||
| JP6238616A |
Attorney, Agent or Firm:
Yusuke Hiraki
Yasushi Hayakawa
Yasushi Hayakawa