Title:
電子・電気機器部品屑の組成解析装置、電子・電気機器部品屑の処理装置及び電子・電気機器部品屑の処理方法
Document Type and Number:
Japanese Patent JP7092889
Kind Code:
B2
Abstract:
Provided is an apparatus for analyzing composition of electronic and electrical device part scraps which can determine a composition of part scraps in the electronic and electrical device part scraps in a short time, a device for processing electronic and electrical device part scraps, and a method for processing electronic and electrical device part scraps using those devices. An apparatus for analyzing a composition of electronic and electrical device part scraps including a classification data storage means for storing a classification data for extracting images of a plurality of component types of electronic and electrical device part scraps from a captured image of electronic and electrical device part scraps composed of the plurality of component types and classifying extracted images into each of the plurality of component types, a classification means for classifying the extracted images into each of the plurality of component types extracted from the captured image of the electronic and electrical device part scraps according to the classification data, and analysis means for analyzing at least one of an area, a number, an average particle size, and weight ratio of each of the plurality of component types classified by the classification means.
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Inventors:
Tomoya Gota
Toshifumi Kawamura
Toshifumi Kawamura
Application Number:
JP2020554011A
Publication Date:
June 28, 2022
Filing Date:
October 30, 2019
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
G06T7/60; B09B3/00; C22B7/00; C22B15/00
Domestic Patent References:
| JP2001229385A | ||||
| JP2016218979A | ||||
| JP6226239A | ||||
| JP2012115785A | ||||
| JP2018118223A |
Foreign References:
| CN107999405A |
Attorney, Agent or Firm:
Axis International Patent Business Corporation