Title:
COMPOSITION COMPRISING POLYAMIDE RESIN
Document Type and Number:
Japanese Patent JP2001234065
Kind Code:
A
Abstract:
To obtain a resin composition suitable for an industrial material such as an automobile part, an electronic and an electric parts, an industrial mechanical part, etc., having excellent rigidity, strength, impact strength, heat resistance and rigidity and dimensional stability in water absorption, etc.
This resin composition is obtained by compounding (A) a polyamide with (B) a polyamide complex which comprises an apatite type compound containing an organic substance insoluble in a phenol solvent in an amount of 0.5-100 pts.wt. of the organic substance based on 100 pts.wt. of the apatite type compound or a polyamide resin complex obtained by compounding the polyamide complex with another resin and (C) a polyphenylene sulfide resin.
Inventors:
ARAMAKI MASAAKI
Application Number:
JP2000045803A
Publication Date:
August 28, 2001
Filing Date:
February 23, 2000
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
C08L77/00; C08K3/32; C08L81/02; C08L101/00; (IPC1-7): C08L77/00; C08K3/32; C08L81/02; C08L101/00