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Patent Searching and Data


Title:
COMPOSITION CONTAINING RESIN MIXTURE AND WOOD FLOUR
Document Type and Number:
Japanese Patent JPH10259308
Kind Code:
A
Abstract:

To obtain a composition which can give a molding being delamination- free and not marked deteriorated in strengths by composting at least two resins with a wood flour in a specified ratio by heat melting.

70-40 pts.wt. at least two resins are composited with 30-60 pts.wt. wood flour be heat melting. The resins which can be desirably used are waste plastics. The resins are desirably modified or unmodified polyphenylene ether resins, acrylonitrile/butadiene/styrene resins, acrylonitrile/styrene resins and polystyrene resins. The wood flours used are exemplified by broken chips, pulps, wastes produced from a wood processing process and sawdust. Like conventional plastics, this composition can be used in the form of moldings. It is injection-molded into a house foundation packing or formed into a ceiling material for a bathroom by profile extrusion.


Inventors:
UOHASHI HIROMICHI
Application Number:
JP8556597A
Publication Date:
September 29, 1998
Filing Date:
March 21, 1997
Export Citation:
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Assignee:
ECO POLYMER KK
International Classes:
C08L25/04; C08L25/12; C08L55/02; C08L71/00; C08L71/12; C08L97/02; C08L101/00; (IPC1-7): C08L97/02; C08L25/04; C08L25/12; C08L55/02; C08L71/12; C08L101/00
Attorney, Agent or Firm:
Mitsuo Matsui