Title:
樹脂材料のエッチング処理用組成物
Document Type and Number:
Japanese Patent JP5830807
Kind Code:
B2
Abstract:
The present invention relates to a composition for etching treatment of a resin material, the composition comprising an aqueous solution having a permanganate ion concentration of 0.2 mmol/L or more and a total acid concentration of 10 mol/L or more with an upper limit of 15 mol/L, and the aqueous solution satisfying the following condition (2):
(2) setting the divalent manganese ion molar concentration to 15 or more times higher than the permanganate ion molar concentration, and
wherein the aqueous solution optionally further satisfies at least one of the following conditions (1) and (3):
(1) containing an organic sulfonic acid in an amount of 1.5 mol/L or more, and
(3) setting the addition amount of an anhydrous magnesium salt to 0.1 to 1 mol/L.
Inventors:
Shingo Nagamine
Koji Kita
Kuniaki Otsuka
Koji Kita
Kuniaki Otsuka
Application Number:
JP2015507841A
Publication Date:
December 09, 2015
Filing Date:
October 16, 2014
Export Citation:
Assignee:
Okuno Pharmaceutical Co., Ltd.
International Classes:
C23C18/24; C09K13/06; C23C18/30
Domestic Patent References:
| JP2008031513A | 2008-02-14 | |||
| JP2002530529A | 2002-09-17 | |||
| JP2004335879A | 2004-11-25 | |||
| JPH0253967U | 1990-04-18 | |||
| JP2010535935A | 2010-11-25 | |||
| JP2000013000A | 2000-01-14 | |||
| JP2008031513A | 2008-02-14 |
Attorney, Agent or Firm:
Patent Business Corporation Saegusa International Patent Office