Title:
樹脂成形体に対するエッチング処理用組成物
Document Type and Number:
Japanese Patent JP5177426
Kind Code:
B2
Abstract:
The present invention provides a composition for the etching treatment of a resin molded article. The composition is composed of an aqueous solution containing 20 to 1,200 g/l of an inorganic acid, 0.01 to 10 g/l of a manganese salt, and 1 to 200 g/l of at least one component selected from the group consisting of halogen oxoacids, halogen oxoacid salts, persulfate salts, and bismuthate salts. The etching composition of the invention is a novel etching solution capable of forming a plating film having a good adhesion to various resin molded articles made of ABS resins or the like, and can be used in place of chromic acid mixtures. The composition is highly safe so that the liquid waste is easily disposed of.
Inventors:
Kazuya Sato
Yusuke Yoshikane
Yusuke Yoshikane
Application Number:
JP2008511994A
Publication Date:
April 03, 2013
Filing Date:
March 02, 2007
Export Citation:
Assignee:
Okuno Pharmaceutical Co., Ltd.
International Classes:
C09K13/04; C09K13/06; C23C18/24
Domestic Patent References:
| JPS5089476A | 1975-07-17 | |||
| JP2002530529A | 2002-09-17 |
Attorney, Agent or Firm:
Eiji Saegusa
Mutsuko Nakano
Masahito Hayashi
Mutsuko Nakano
Masahito Hayashi
Previous Patent: JPS5177425
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