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Title:
COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL AND ITS MOLDING MATERIAL
Document Type and Number:
Japanese Patent JP2005247879
Kind Code:
A
Abstract:

To obtain a composition for a molding material, having the same adhesive strength of a carbon fiber as an epoxy resin has and excellent physical properties of a cured material while keeping the curing rate of a vinyl ester resin and a fiber-reinforced composite material.

The composition for a fiber-reinforced composite material comprises (A) 100 parts by mass of a resin or mixed resin containing a radically polymerizable unsaturated group and an epoxy group, (B) 0-200 parts by mass of a radically polymerizable monomer and/or an epoxy diluent, (C) 0.5-200 parts by mass of a curing agent, (D) 5-2,000 parts by mass of a reinforced fiber and (E) 0-200 parts by mass of a thickener.


Inventors:
KAKU JU
HORIKOSHI KATSURA
WATANABE NORISHIGE
Application Number:
JP2004055679A
Publication Date:
September 15, 2005
Filing Date:
March 01, 2004
Export Citation:
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Assignee:
SHOWA HIGHPOLYMER
International Classes:
C08J5/04; C08G59/20; (IPC1-7): C08G59/20; C08J5/04
Domestic Patent References:
JPS62225537A1987-10-03
JPH05140264A1993-06-08
JPH02206614A1990-08-16
JPH02212506A1990-08-23
JPH01278523A1989-11-08
JP2004502865A2004-01-29
JPH02215841A1990-08-28
JP2001294687A2001-10-23
JP2000334874A2000-12-05
Foreign References:
WO2004067612A12004-08-12
Attorney, Agent or Firm:
Tamotsu Otani