COMPOSITION FOR FORMING INSULATING FILM

Japanese Patent JP2009242440

A

To provide a composition for forming an insulating film, which can form an insulating film having a lowered dielectric constant using a hole forming agent, wherein the generation of spaces (voids) in which holes are connected to one another is prevented.

An insulating film is formed by using a composition for forming an insulating film, characterized by comprising (A) a polyphenylene, (B) a styrene polymer and (C) a block copolymer or a graft copolymer comprising a unit having affinity to the polyphenylene (A) and a unit having affinity to the styrene polymer (B).

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INABE HARUKI

JP2008087059A

October 22, 2009

March 28, 2008

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FUJIFILM CORP

C09D125/00; C08L25/04; C08L65/02; C09D5/25; C09D125/06; C09D151/00; C09D153/00; C09D153/02; H01L21/312

JP2005193657A	2005-07-21
JPH04336286A	1992-11-24

Sadao Kumakura
Nobuo Ogawa
Atsushi Hakoda
Kenji Asai
Koji Hirayama
Satsuki Ichikawa

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