Title:
COMPOSITION FOR FORMING LAYER TO BE PLATED, AND PROCESS FOR PRODUCING LAMINATE HAVING METAL FILM
Document Type and Number:
Japanese Patent JP2012144761
Kind Code:
A
Abstract:
To provide a composition for forming a layer to be plated, which enables the improvement in plating rate in electroless plating and also enables the production of a metal film having further improved adhesion to a substrate, and a process for producing a laminate having the metal film, which is achieved using the composition.
This composition for forming the layer to be plated includes a compound represented by formula (1) and a polymer having a polymerizable group. In the formula, R10 represents hydrogen atom, metal cation or quaternary ammonium cation, L10 represents single bond or divalent organic group, R11-R13 each independently represent hydrogen atom, or substituted or unsubstituted alkyl, and n represents 1 or 2.
Inventors:
TSUKAMOTO NAOKI
Application Number:
JP2011002544A
Publication Date:
August 02, 2012
Filing Date:
January 07, 2011
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
C23C18/20; B32B15/08; C23C18/30; H05K3/18
Domestic Patent References:
| JPH093653A | 1997-01-07 |
Foreign References:
| WO2006080178A1 | 2006-08-03 |
Attorney, Agent or Firm:
Nozomi Watanabe
Haruko Sanwa
Hideaki Ito
Fumio Mitsuhashi
Haruko Sanwa
Hideaki Ito
Fumio Mitsuhashi