COMPOSITION FOR FORMING PLATED LAYER, PRODUCTION METHOD FOR METAL PATTERN MATERIAL AND METAL PATTERN MATERIAL OBTAINED THEREBY, AND PRODUCTION METHOD FOR SURFACE METAL FILM MATERIAL AND SURFACE METAL FILM MATERIAL OBTAINED THEREBY

Title:

Document Type and Number:

Japanese Patent JP2010077322

Kind Code:

A

Abstract:

To provide a composition for forming a plated layer capable of forming a layer to be plated exhibiting excellent adhesion to a substrate, and the like.

There is provided the composition for forming the layer to be plated which contains a polymer having a radically polymerizable group, a functional group having an active hydrogen directly bonded with a carbon atom of 10pKa16, and an ionizable adsorption group, and the like.

Inventors:

KANO TAKEYOSHI

Application Number:

JP2008249209A

Publication Date:

April 08, 2010

Filing Date:

September 26, 2008

Export Citation:

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Assignee:

FUJIFILM CORP

International Classes:

C08F220/34; C23C18/20; H05K3/18; H05K3/38

Domestic Patent References:

JP2004018859A	2004-01-22
JP2005232195A	2005-09-02
JP2008020632A	2008-01-31
JP2008088273A	2008-04-17
JP2008149586A	2008-07-03

Attorney, Agent or Firm:

Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda

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