COMPOSITION FOR FORMING POROUS ORGANO POLYSILICA DIELECTRIC MATERIAL

Title:

COMPOSITION FOR FORMING POROUS ORGANO POLYSILICA DIELECTRIC MATERIAL

Document Type and Number:

Japanese Patent JP2007238957

Kind Code:

A

Abstract:

To introduce uniformly distributed pores or voids in order to lower the dielectric constant of an intermediate layer of an electronic device, an intermetal, or an insulator in manufacturing an electronic component; and to reduce the reflection of active rays during photoresist exposure.

The composition useful for forming a porous organo polysilica dielectric material comprises a removable porogen. The porogen comprises one or more chromophores selected from the group consisting of phenyl, substituted phyenyl, naphthyl, substituted napthyl, anthracenyl, substituted anthracenyl, phenanthrenyl, substituted phenanthrenyl, and a monomer containing one or more (4-24C) alkyl groups.

Inventors:

ZAMPINI ANTHONY
GALLAGHER MICHAEL K

Application Number:

JP2007150981A

Publication Date:

September 20, 2007

Filing Date:

June 06, 2007

Export Citation:

Click for automatic bibliography generation Help

Assignee:

ROHM & HAAS ELECT MAT

International Classes:

C08L83/04; C08F20/18; G03F7/004; C08F230/08; C08F290/06; C08L33/04; C08L55/00; C08L83/02; C08L101/02; C09D5/32; C09D183/04; H01L21/027; H01L21/312; H01L21/316; H05K1/03; H05K3/00

Domestic Patent References:

JPH10204328A	1998-08-04
JPH06118631A	1994-04-28
JPH10186647A	1998-07-14

Foreign References:

WO1999063587A1

1999-12-09

Attorney, Agent or Firm:

Patent Business Corporation Sender International Patent Office

Previous Patent: IMPROVED ASPHALT FOR HEAT CONSTRUCTION METHOD CAPABLE OF BEING USED AT LOW TEMPERATURE

Next Patent: FOAM OF URETHANE-BASED THERMOPLASTIC ELASTOMER COMPOSITION AND PROCESS FOR PRODUCING THE FOAM