Title:
COMPOSITION FOR FORMING PROTECTIVE FILM
Document Type and Number:
Japanese Patent JP2016105171
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a novel composition for forming a protective film which, in a lithography technique using EUV or an electron beam, can improve nano edge roughness by reducing effects of OOB which occur at the time of exposure, satisfies resolution and sensitivity sufficiently, and also can suppress generation of an outgas.SOLUTION: The composition for forming a protective film is used for surface protection of a resit film in a resist pattern forming method using EUV or an electron beam, comprises [A] a polymer and [B] an organic solvent, where [A] the polymer includes a structural unit (I) containing a group represented by the following formula (i-1) (however, excluded is an EUV resist upper layer-forming composition used in an EUV lithography process, comprising; a resin having a naphthalene ring on a main chain or a side chain; and a solvent). In the following formula (i-1), n is 0, 2, or 3; and m is an integer which satisfies: 1≤m≤5+2n.SELECTED DRAWING: None
Inventors:
MARUYAMA KEN
INUKAI KOJI
INUKAI KOJI
Application Number:
JP2015233444A
Publication Date:
June 09, 2016
Filing Date:
November 30, 2015
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/11; C08F12/00; C09D7/12; C09D125/00; G03F7/20; H01L21/027
Domestic Patent References:
JP2008198788A | 2008-08-28 | |||
JP2010211226A | 2010-09-24 | |||
JP2013140319A | 2013-07-18 | |||
JP2012176526A | 2012-09-13 | |||
JP2005352384A | 2005-12-22 | |||
JP2006243309A | 2006-09-14 |
Foreign References:
WO2012053302A1 | 2012-04-26 |
Attorney, Agent or Firm:
Hajime Amano