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Title:
COMPOSITION FOR FORMING UNDERLAY FILM, METHOD FOR FORMING UNDERLAY FILM AND SELF ASSEMBLE LITHOGRAPHY PROCESS
Document Type and Number:
Japanese Patent JP2016161886
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming an underlay film enhancing heat resistance while increasing clarity of a phase separation structure by a self assembly and rectangle property of a pattern, a method for forming an underlay film and a self assemble lithography process.SOLUTION: There is provided a composition for forming an underlay film used for forming an underlay film 102 of a self assemble film 105 in a self assemble lithography process and containing a polymer having a structural unit derived from an ethylenic unsaturated compound containing a naphthalene ring and a solvent. The polymer is preferably an acenaphthylene polymer. Absorbance index of the underlay film is preferably 0.15 or more and 0.40% or less. 5% reduction temperature in a thermal mass measurement of the underlay film is preferably 270°C or higher. Weight average molecular weight of the polymer is preferably 1,000 or more and 20,000 or less. It is preferable to contain further a crosslinking agent and the polymer has a crosslinkable group.SELECTED DRAWING: Figure 4

Inventors:
MINEGISHI SHINYA
NAMIE YUJI
NAGAI TOMOKI
KOMATSU HIROYUKI
Application Number:
JP2015043019A
Publication Date:
September 05, 2016
Filing Date:
March 04, 2015
Export Citation:
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Assignee:
JSR CORP
International Classes:
G03F7/11; C08F32/08; G03F7/40; H01L21/027
Domestic Patent References:
JP2010139845A2010-06-24
JP2013516643A2013-05-13
JP2013228447A2013-11-07
JP2009251130A2009-10-29
JP2013145368A2013-07-25
JP2004168748A2004-06-17
Foreign References:
WO2013054702A12013-04-18
WO2014014034A12014-01-23
WO2014188806A12014-11-27
Attorney, Agent or Firm:
Hajime Amano
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kazuki Kagami
Kenichi Fujinaka