Title:
COMPOSITION FOR INJECTION MOLDING
Document Type and Number:
Japanese Patent JPS59116172
Kind Code:
A
Abstract:
A composition for injection molding a sinterable material such as silicon nitride. This composition includes a binder system which imparts a greater flexibility to the, as molded, green body. The binder-system contains a major component of paraffin wax, a minor component of epoxy resin, and a surfactant.
Inventors:
KENESU DABURIYUU FURENCHI
JIEFURII TEII NIIRU
RARII ERU TAANBOO
JIEFURII TEII NIIRU
RARII ERU TAANBOO
Application Number:
JP23803983A
Publication Date:
July 04, 1984
Filing Date:
December 19, 1983
Export Citation:
Assignee:
GTE LABORATORIES INC
International Classes:
B29C35/00; B29C45/00; C04B35/632; C04B35/634; C04B35/636; C08K3/22; C08K3/28; (IPC1-7): B29F1/00; C04B35/00
Attorney, Agent or Firm:
Motohiro Kurauchi