PURPOSE: To obtain a composition for an insulating layer for electronic parts each having a multilayered circuit formed on a substrate with an insulating layer in-between by blending glass powder contg. specified percentages of PbO, B2O3, SiO2 and Al2O3 with a filler.

CONSTITUTION: This composition consists of 40W95wt% glass powder and 5W 60wt% filler, and the glass powder contains, by weight, 35W50% PbO, 0W10% ZnO, 1W15% B2O3, 35W55% SiO2, 1W15% Al2O3, 0W2% SnO2, 1W10% MgO+ CaO+BaO+SrO and 0W5% Li2O+Na2O+K2O. It is preferable that the filler minimizes a change in the characteristics of the conductor and resistor of a circuit by calcination and softens at a temp. above the calcining temp. of the circuit. The especially desired filler is corundum, zirconium silicate or quartz.