Title:
COMPOSITION FOR LIGHT MOLDING
Document Type and Number:
Japanese Patent JP2019044148
Kind Code:
A
Abstract:
To provide a composition for light molding capable of increasing mechanical physical property of a molded article under a high temperature environment, and sufficiently decreasing viscosity during molding.SOLUTION: A composition for light molding contains a photocurable resin, an inorganic filler and an additive which is a compound having an amide bond and a C=C unsaturated double bond in a molecule. The additive may be selected from N-vinylformamide and 4-acrylo morpholine. The inorganic filler may be layered silicate compound such as talc, silica, mica. Under the high temperature environment of a molded article, storage elasticity modulus can be made at 2000 MPa or more and viscosity can be made at less than 2000 mPa s during molding.SELECTED DRAWING: None
Inventors:
UEMOTO KOHEI
ISHIDA KIICHIRO
KOBASHI KAZUTERU
ISHIDA KIICHIRO
KOBASHI KAZUTERU
Application Number:
JP2018091857A
Publication Date:
March 22, 2019
Filing Date:
May 11, 2018
Export Citation:
Assignee:
ENPLAS CORP
International Classes:
C08F2/48; B29C64/264; B33Y70/00; C08F2/44; C08F26/02; C08F26/06
Domestic Patent References:
| JP2001310918A | 2001-11-06 | |||
| JP2004238597A | 2004-08-26 | |||
| JPH1030002A | 1998-02-03 | |||
| JP2017114701A | 2017-06-29 | |||
| JP2007262401A | 2007-10-11 |
Foreign References:
| CN103755889A | 2014-04-30 |
Attorney, Agent or Firm:
Onuki Kotake International Patent Office