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Title:
COMPOSITION FOR LOW-PRESSURE BONDING
Document Type and Number:
Japanese Patent JPS5589373
Kind Code:
A
Abstract:

PURPOSE: The title adhesive composition having improved adhesion and water resistance, capable of bonding and laminating under a low pressure, free from surface unevenness, comprising an aqueous emulsion of vinylurethane resin and glass microballoons as a filler.

CONSTITUTION: A composition for low-pressure bonding comprising (A) an aqueous emulsion of a vinylurethane resin, e.g. formed by reacting 100pts.wt. of a resin component comprising polyvinyl alcohol resin and polyvinyl acetate resin with 10W15pts.wt. of an isocyanate-type curing agent, (B) glass microballoons having the same specific gravity as (A), at a weight ratio of (A) to (B) of 100:1W5.

EFFECT: High-quality decorative plywood or coated materials can be obtained by means of an inexpensive low-pressure type press. Low-grade materials are usable as the substrate.

USE: Exterior decoration of pianos and furniture.


Inventors:
OGATA TOMOHIDE
Application Number:
JP16188278A
Publication Date:
July 05, 1980
Filing Date:
December 27, 1978
Export Citation:
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Assignee:
NIPPON MUSICAL INSTRUMENTS MFG
International Classes:
C08K7/00; C08G18/00; C08G18/62; C08K7/16; C08K7/28; C08L75/00; C08L75/04; C09J175/00; (IPC1-7): C08G18/62; C08K7/28; C08L75/04; C09J3/16