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Title:
COMPOSITION FOR MANUFACTURING RESIST PATTERN, ELECTRODEPOSITION COATING BATH USING IT, AND MANUFACTURE OF RESIST PATTERN
Document Type and Number:
Japanese Patent JPH04153275
Kind Code:
A
Abstract:

PURPOSE: To obtain the title composition improved in electrodeposition properties, accuracy of resist pattern, etc., by mixing a specified acrylic resin, a compound having photopolymerizable unsaturated bonds, a photopolymerization initiator, a water-soluble film stabilizer, a basic compound, and water.

CONSTITUTION: (Meth)acrylic acid and comonomers consisting of 60-85wt.% methyl methacrylate and other monomer(s) are copolymerized in the presence of a polymerization initiator in an organic solvent to give an acrylic resin (A) having an acid value of 20-300 and a weight-average molecular weight (in terms of standard PS) of 5,000 to 150,000. 100 pts.wt. mixture of 50-85 pts.wt. resin A and 15-50 pts.wt. compound having photopolymerizable unsaturated bonds, comprising a water-insoluble monomer having at least two photopolymerizable unsaturated bonds in the molecule is mixed with 0.1-15 pts.wt. photopolymerization initiator, 0.01-10 pts.wt. water-soluble film stabilizer selected among monohydric and polyhydric phenol compounds and imidazole compounds, a basic compound for neutralizing the resin A, in an amount of 0.2-1.0 equivalent per equivalent of the COOH group of component A, and water.


Inventors:
TACHIKI SHIGEO
KO MASAHIKO
AKAHORI SATOHIKO
KATO TAKURO
YAMAZAKI YUJI
TAKAHASHI TOSHIYA
SHIOTANI TOSHIHIKO
NAGASHIMA YOSHIHISA
Application Number:
JP27698690A
Publication Date:
May 26, 1992
Filing Date:
October 16, 1990
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H05K3/06; C09D4/02; C09D5/44; C09D133/02; C09D171/00; (IPC1-7): C09D4/02; C09D5/44; C09D133/02; H05K3/06
Attorney, Agent or Firm:
Kunihiko Wakabayashi