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Title:
金属ナノ粒子分散物の合成
Document Type and Number:
Japanese Patent JP5394749
Kind Code:
B2
Abstract:
Disclosed are compositions comprising metallic nanoparticles suitable for use in cohesive, highly conductive structures on substrates. Also disclosed are methods for synthesizing the compositions and methods for forming cohesive, highly conductive structures from the compositions.

Inventors:
Jablonski, Gregory, A.
Mastro Pietro, Michael, A.
Wargo, Christopher, Jay.
Application Number:
JP2008547524A
Publication Date:
January 22, 2014
Filing Date:
December 20, 2006
Export Citation:
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Assignee:
Peakem Associates, Ink.
International Classes:
B22F9/00; B22F1/0545; B22F1/102; B22F9/24; C01G3/02; C01G5/00; C01G7/00; C09C1/62; C09D11/10; H01B1/22; H01B13/00
Domestic Patent References:
JP2005536634A
JP2002121606A
Attorney, Agent or Firm:
Taro Yaguchi