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Title:
COMPOSITION FOR NEGATIVE ELECTRODEPOSITION PHOTORESIST, ELECTRODEPOSITION LIQUID COMPRISING BY USING THE SAME AND ELECTRODEPOSITION COATING FILM FORMED FROM THE LIQUID
Document Type and Number:
Japanese Patent JP2003330188
Kind Code:
A
Abstract:

To provide an electrodeposition coating film which is uniform on a fine substrate and does not exposure the edge part of the objective material and to provide an electrodeposition liquid for a negative resist and an electrodeposition liquid composition to form the coating film.

The electrodeposition coating film is formed by using the following negative electrodeposition photoresist liquid. The electrodeposition liquid is prepared by using (a) cationic water-soluble or water-dispersible (meth)acrylic resin, (b) polyfunctional (meth)acrylic monomer, (c) photopolymerization initiator, (d) neutralizing agent for the component (a), (e) organic solvent and (f) deionized water and by controlling the maximum difference in the hysteresis loop of shear stress of the composition consisting of the components (a), (b) and (c) to more than 3 mN/cm2 and less than 10 mN/cm2.


Inventors:
TAKAMAGARI KENJI
Application Number:
JP2002173385A
Publication Date:
November 19, 2003
Filing Date:
May 13, 2002
Export Citation:
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Assignee:
HONNY CHEMICAL IND
International Classes:
G03F7/033; C08F2/44; C08F265/06; G03F7/027; (IPC1-7): G03F7/033; C08F2/44; C08F265/06; G03F7/027
Attorney, Agent or Firm:
Hoshino Noboru