PURPOSE: To stabilize CH2Cl2 and to obtain a compsn. having superior peeling power, especially suitable for manufacture of a printed circuit by incorporating one of epoxides or amines in the photoresist peeling compsn. contg. CH2Cl2 and alcohol as essential components.

CONSTITUTION: The photoresist peeling compsn. is prepared by adding an epoxide or amine in an amt. of 0.02W3wt% of the total peeling compsn. to the essential component mixture of CH2Cl2 and alcohol in a mixing ratio of (7:1)W(25:1). Further, a small amt. of 1,2-dichloroethane may be added to enhance the peeling power. The epoxides or the amines has a great effect for stabilizing CH2Cl2, and prevents its decomposition due to metals, oils, light, and water, and also the printed circuits from undergoing adverse effects due to acid produced from its decomposition, and permits a peeling agent strong in peeling power to be obtained.