Title:
COMPOSITION FOR POLISHING COMPOUND SEMICONDUCTOR WAFER AND POLISHING METHOD FOR COMPOUND SEMICONDUCTOR USING THE SAME
Document Type and Number:
Japanese Patent JP2001068438
Kind Code:
A
Abstract:
To provide a polishing composition for mirror finishing the surface of a compound semiconductor wafer which is not adverse to a work environment, with less environmental contamination, and which is excellent in stability and durability for polishing.
A peroxide or peroxoacid compound, and water-soluble amine are contained with pH at 7.0-10.5, its peroxide value is 3-1500 millimol, and the content of water-soluble amine is 0.01-0.5 mol/kg. The water-soluble amine is preferred to contain at least one alcohol hydroxyl group in its structure, with triethanol amine especially preferred.
Inventors:
TANAKA HIROAKI
TANIWAKI TSUKASA
INOUE HIROAKI
TANIWAKI TSUKASA
INOUE HIROAKI
Application Number:
JP23732899A
Publication Date:
March 16, 2001
Filing Date:
August 24, 1999
Export Citation:
Assignee:
SPEEDFAM CO LTD
International Classes:
B24B37/00; C09K3/14; C09K13/06; H01L21/304; (IPC1-7): H01L21/304; B24B37/00; C09K3/14; C09K13/06
Attorney, Agent or Firm:
Hiroshi Tanaka (1 outside)
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