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Title:
COMPOSITION FOR POLISHING AND POLISHING METHOD
Document Type and Number:
Japanese Patent JP2008260105
Kind Code:
A
Abstract:

To provide a composition for polishing and a polishing method, which polishes a nickel phosphorous-plated disc substrate more suitably.

This composition for polishing comprises: a pad degrading inhibitor selected from a diethylenetriamine penta-acetic acid, a hydroxy ethyl ethylenediamine triacetic acid, a triethylenetetramine hexa-acetic acid and a glutamic acid diacetic acid, and their alkali metal salts and ammonium salts; and an oxidizer. Preferably, the composition further comprises at least one kind of a phenol compound, a phosphate and abrasive grain. This composition is preferably used together with a suede type polishing pad.


Inventors:
HIRANO JUNICHI
ISOMURA AKITSUGU
YOKOMICHI NORITAKA
ARAI MASAHIRO
SATO SAYAKA
FUJITA YUTA
Application Number:
JP2007105830A
Publication Date:
October 30, 2008
Filing Date:
April 13, 2007
Export Citation:
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Assignee:
FUJIMI INC
LION CORP
International Classes:
B24B37/00; C09K3/14
Domestic Patent References:
JP2007067089A2007-03-15
JP2005243673A2005-09-08
JPH1121545A1999-01-26
JP2006049912A2006-02-16
JPH04363385A1992-12-16
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda