COMPOSITION, POLISHING PAD AND METHOD FOR PRODUCING COMPOSITION

Title:

COMPOSITION, POLISHING PAD AND METHOD FOR PRODUCING COMPOSITION

Document Type and Number:

Japanese Patent JP2013203782

Kind Code:

A

Abstract:

To provide a composition having high elongation, a method for producing the composition, and a polishing pad causing few defects on a wafer surface and having an extended pad service life.

A composition includes a polymer obtained from an ethylenically unsaturated compound by polymerization and polyurethane, wherein a compound represented by formula (1) is included as the ethylenically unsaturated compound. In the formula, R¹ and R³ are hydrogen; R² is hydrogen or alkyl; and R⁴ is an organic group including a structure in which six or more carbon atoms and/or oxygen atoms link together in a straight chain.

Inventors:

MIZUTANI ATSUKO
OZEKI TAKENARI
YAMAMOTO TETSUYA

Application Number:

JP2012071578A

Publication Date:

October 07, 2013

Filing Date:

March 27, 2012

Export Citation:

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Assignee:

TORAY INDUSTRIES

International Classes:

C08L33/06; B24B37/24; C08F2/00; C08J5/14; C08L33/14; C08L75/04; H01L21/304

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