Title:
COMPOSITION FOR PREPARING LOW DIELECTRIC MATERIAL CONTAINING SOLVENT
Document Type and Number:
Japanese Patent JP2009091582
Kind Code:
A
Abstract:
To provide silica-based materials and films having a dielectric constant of 3.7 or below, and to provide compositions and methods for making and using same.
There is provided a composition for preparing the silica-based material comprising at least one silica source, a solvent, and at least one porogen, optionally a catalyst, and optionally a flow additive wherein the solvent boils at a temperature ranging 90-170C, and is selected from the group of compounds represented by the following formulas: HO-CHR8-CHR9-CH2-CHR10R11 (where R8, R9, R10 and R11 can independently be a 1-4C alkyl group or a hydrogen atom); and R12-CO-R13 (where R12 is a 3-6C hydrocarbon group, R13 is a 1-3C hydrocarbon group); and mixtures thereof.
Inventors:
WEIGEL SCOTT J
KHOT SHRIKANT N
MACDOUGALL JAMES EDWARD
BRAYMER THOMAS ALBERT
KIRNER JOHN FRANCIS
PETERSON BRIAN KEITH
KHOT SHRIKANT N
MACDOUGALL JAMES EDWARD
BRAYMER THOMAS ALBERT
KIRNER JOHN FRANCIS
PETERSON BRIAN KEITH
Application Number:
JP2008286882A
Publication Date:
April 30, 2009
Filing Date:
November 07, 2008
Export Citation:
Assignee:
AIR PROD & CHEM
International Classes:
C08G77/00; C01B33/16; C08L83/04; C08L83/00; C09D5/25; C09D183/02; C09D183/04; C09D183/14; C09D201/00; H01B17/56; H01B19/00; H01L21/312; H01L21/316; H01L21/469; H01L21/4763; H01L21/768; H01L23/522
Domestic Patent References:
| JP2004027030A | 2004-01-29 | |||
| JP2001200203A | 2001-07-24 | |||
| JP2003100738A | 2003-04-04 | |||
| JP2004051468A | 2004-02-19 | |||
| JP2003330174A | 2003-11-19 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu