Title:
COMPOSITION FOR RESIN
Document Type and Number:
Japanese Patent JP2013136760
Kind Code:
A
Abstract:
To facilitate, in a composition for resin using an inorganic compound having a sulfur atom and/or selenium atom, the operation of cast polymerization by reducing the viscosity of the composition for resin.
The composition for resin includes: (a) 1-50 pts.wt. of an inorganic compound having sulfur atom and/or selenium atom; (b) 50-99 pts.wt. of a compound represented by formula (1), (m is an integer of 0-4, and n is an integer of 0-2); and (c) 1-20 pts.wt. of a compound C having one or more disulfide bonds, which cannot be represented by formula (1). The compound (a) and the compound (b) are preliminarily subjected to prepolymerization for 1 minute to 72 hours at 0-150°C in the presence of imidazole as a preliminary reaction catalyst.
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Inventors:
KAMURA TERUO
TAKEUCHI MOTOHARU
KINO MASAHIRO
TAKEUCHI MOTOHARU
KINO MASAHIRO
Application Number:
JP2013015729A
Publication Date:
July 11, 2013
Filing Date:
January 30, 2013
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08G75/08; C08G79/00; G02B1/04; G02C7/00
Domestic Patent References:
| JP2004269673A | 2004-09-30 | |||
| JP2004043526A | 2004-02-12 | |||
| JP2001002933A | 2001-01-09 | |||
| JP2004137481A | 2004-05-13 | |||
| JP2001002783A | 2001-01-09 |