Title:
COMPOSITION FOR THREE-DIMENSIONAL MOLDING
Document Type and Number:
Japanese Patent JP2020117645
Kind Code:
A
Abstract:
To provide a composition that is quickly cured in the presence of oxygen, and can produce a three-dimensional molding having high hardness and excellent adhesion to metal and glass.SOLUTION: A composition for three-dimensional molding contains a cationic polymerizable compound, and a light or thermal polymerization initiator, and the cationic polymerizable compound at least includes a compound having, in one molecule, at least one cationic polymerizable group selected from a vinyl ether group, an epoxy group, and an oxetanyl group, and at least one hydroxy group, and a compound represented by formula (b).SELECTED DRAWING: None
Inventors:
MIZUTA TOMOYA
INOUE KEIZO
INOUE KEIZO
Application Number:
JP2019011723A
Publication Date:
August 06, 2020
Filing Date:
January 25, 2019
Export Citation:
Assignee:
DAICEL CORP
International Classes:
C08G59/18; C08F2/50; C08L35/08; C08L63/00; C09D11/38
Attorney, Agent or Firm:
Goto Patent Office