Title:
COMPOSITION FOR THREE-DIMENSIONAL MOLDING
Document Type and Number:
Japanese Patent JP2020117646
Kind Code:
A
Abstract:
To provide a composition which is rapidly cured even under a high-humidity environment and allows for accurately producing a three-dimensional molded article having excellent adhesion not only to plastics but also to metals and glass.SOLUTION: A composition for three-dimensional molding according to the present invention contains a cationically polymerizable compound and a photo- or thermal polymerization initiator. The cationically polymerizable compound contains at least a compound (A) having a vinyl ether group and a hydroxyl group, a compound (B) having an oxetanyl group and a hydroxyl group, and a compound (C) represented by the following formula (c). The total content of the compound (A), the compound (B) and the compound (C) is 50 wt.% or more of the total amount of the cationically polymerizable compound. The content [A] of the compound (A) and the content [B] of the compound (B) satisfy the following formula (1): A/(A+B)≥0.3.SELECTED DRAWING: None
Inventors:
MIZUTA TOMOYA
INOUE KEIZO
INOUE KEIZO
Application Number:
JP2019011724A
Publication Date:
August 06, 2020
Filing Date:
January 25, 2019
Export Citation:
Assignee:
DAICEL CORP
International Classes:
C08G59/22; C08F2/50; C08L35/08; C08L63/00; C09D11/38
Attorney, Agent or Firm:
Goto Patent Office