Title:
プラグの深さのばらつきが低減されたハニカム体を充填するための組成物と方法
Document Type and Number:
Japanese Patent JP6290215
Kind Code:
B2
Abstract:
A composition for applying to a honeycomb body includes a refractory filler, an organic binder, an inorganic binder, and a liquid vehicle, wherein the refractory filler, the particle size distribution of the refractory filler, the organic binder, and the inorganic binder are selected such that, when the composition is applied to plug a plurality of channels of the honeycomb body, the plug depth variability is reduced.
Inventors:
Bab, Keith Norman
Cheche, Anthony Joseph
Cronin, Alison Elizabeth
Salma, Fusava Hana Cucibotola
Warren, Courtney Spencer
Cheche, Anthony Joseph
Cronin, Alison Elizabeth
Salma, Fusava Hana Cucibotola
Warren, Courtney Spencer
Application Number:
JP2015529990A
Publication Date:
March 07, 2018
Filing Date:
August 28, 2013
Export Citation:
Assignee:
CORNING INCORPORATED
International Classes:
C04B35/195; B01D39/20; B01D46/00; B28B11/02; C04B35/478; C04B35/63
Domestic Patent References:
| JP2012045926A | ||||
| JP2010522106A | ||||
| JP2009543755A | ||||
| JP2009507745A |
Attorney, Agent or Firm:
Yanagita Seiji
Go Sakuma
Go Sakuma