Title:
再閉可能包装のための組成物および多層フィルム
Document Type and Number:
Japanese Patent JP7317001
Kind Code:
B2
Abstract:
The present disclosure includes a composition that includes an ethylene/α-olefin random copolymer having density of 0.890 g/cm3 or less, a melting point of 100° C. or less, and a melt index from 0.2 g/10 min to 8.0 g/10 min, a styrenic block copolymer comprising from 1 wt % to less than 50 wt % units of styrene, a tackifier, and an oil. The composition may exhibit an overall melt index of the composition of from 2 g/10 min to 15 g/10 min. The composition can be used as an adhesive in some embodiments. The present disclosure also includes multilayer films that include the composition, which may provide reclose functionality to the multilayer film. The multilayer films that include the composition may provide low initial opening force and improved reclose adhesion through multiple reclose cycles. The present disclosure also includes various types of reclosable packaging articles that include the multilayer films and adhesive compositions.
Inventors:
Wu, Shao Son
Lai, Choan Yea
Himmelberger, Daniel W.
Kalihari, Vivek
Sarah, Christina
Yedab, Vinita
Lai, Choan Yea
Himmelberger, Daniel W.
Kalihari, Vivek
Sarah, Christina
Yedab, Vinita
Application Number:
JP2020513534A
Publication Date:
July 28, 2023
Filing Date:
September 19, 2018
Export Citation:
Assignee:
Dow Global Technologies LLC
International Classes:
C08L23/08; B32B27/18; B32B27/32; B65D65/40; C08L53/00; C08L53/02; C08L57/02; C08L91/00
Domestic Patent References:
| JP2003503553A | ||||
| JP2016021360A | ||||
| JP2018521160A | ||||
| JP2013500359A | ||||
| JP2000507283A |
Attorney, Agent or Firm:
Hiroshi Kobayashi
Eiji Katayama
Norio Omori
Eiji Katayama
Norio Omori