COMPOUND APPARATUS FOR CARRYING OUT INJECTION MOLDING AND CUTTING

Japanese Patent JP3842694

B

PROBLEM TO BE SOLVED: To provide a compound apparatus with injection molding and cutting capable of manufacturing a product without using an intricate and precise mold in a short time.
SOLUTION: The compound apparatus is characterized by comprising that a cutting tool and an injection molding nozzle unit (20) are detachably mountable on a main spindle (16), first the injection molding nozzle unit is detachably mounted on the main spindle (16) then an injection molding product is injection- molded, and next the injection molding nozzle unit mounted on the main spindle (16) is replaced with the cutting tool, the cutting tool is detachably mounted on the main spindle (16) and the injection molding product is cut with the cutting tool.

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Kitamura, Shozo
Kitamura, Akihiro
Kitamura, Kosaku
Anzai, Masahiro
Takahashi, Ichiro

JP2002000151792

August 18, 2006

May 27, 2002

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KITAMURA MACH CO LTD

B22D15/04; B29C45/20; B22D17/20; B23Q3/00; B23Q37/00; B22D15/00; B29C45/20; B22D17/20; B23Q3/00; B23Q37/00; (IPC1-7): B29C45/20; B22D15/04

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