Title:
COMPOUND FOR BONDED MAGNET, MOLDED BODY, AND BONDED MAGNET
Document Type and Number:
Japanese Patent JP2022062149
Kind Code:
A
Abstract:
To provide a compound for a bonded magnet, the compound enhancing the mechanical strength (e.g. crushing strength) of the bonded magnet.SOLUTION: A compound for a bonded magnet comprises a magnetic powder, an epoxy resin, a curing agent, a coupling agent and a metal salt, and the metal salt is represented by R2M, wherein R represents a saturated fatty acid group having from 6 to 10 carbon atoms, and M represents at least one kind of metal element selected from among Ca and Ba.SELECTED DRAWING: None
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Inventors:
TAKEUCHI KAZUMASA
ITO TERUO
HIRANO ARISA
URASHIMA KOSUKE
ITO TERUO
HIRANO ARISA
URASHIMA KOSUKE
Application Number:
JP2022014034A
Publication Date:
April 19, 2022
Filing Date:
February 01, 2022
Export Citation:
Assignee:
SHOWA DENKO MAT CO LTD
International Classes:
H01F1/08; C08G59/32; C08G59/62; C08K3/01; C08K5/098; C08K5/54; C08L63/00
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano