Title:
COMPOUND IC CARD AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2003036433
Kind Code:
A
Abstract:
To provide a compound IC card in which an effective contact area between antenna wire and an IC module is large, the antenna wire and the IC module are reliably connected, contact resistance is small, and failures due to disconnection can be reduced, and a method for manufacturing the compound IC card.
In this compound IC card of a specification that uses wire for an antenna of the compound IC card having both non-contact and contact IC functions in one chip, a metallic plate PAD 12 ranging between 0.035 and 0.1 mm in thickness is used at a connection part between the IC module and the antenna 13.
Inventors:
TAKAYAMA FUMIHIRO
SAITO KOICHI
SAITO KOICHI
Application Number:
JP2001224196A
Publication Date:
February 07, 2003
Filing Date:
July 25, 2001
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B42D15/10; G06K19/07; G06K19/077; H01L25/00; (IPC1-7): G06K19/077; B42D15/10; G06K19/07; H01L25/00