Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COMPOUND LASER BEAM AND PUNCH PROCESSING MACHINE
Document Type and Number:
Japanese Patent JPS61154781
Kind Code:
A
Abstract:

PURPOSE: To improve processing performance by providing a die holder for punching to the frame inside of a laser beam processing machine and disposing the frame of a punching press to which no oscillation is transmitted to the outside circumference thereof.

CONSTITUTION: The C-shaped die holder 7 is provided to the frame inside of the laser beam processing machine 3 and four vibration-proof dampers 9 are disposed at two points on the front and rear thereof. The dampers 9 absorbs the oscillation in the vertical direction to prohibit the transmission of the oscillation in the vertical direction of the frame 3 of the laser beam processing machine. An annular vibration-proof damper 11 and a rod-shaped vibration-proof damper 15 are further provided to the laser beam processing machine to prevent the longitudinal and transverse oscillations of the machine as well. The laser 33 of a laser generator 5 executes consequently processing without the influence of the oscillation and the compound processing capacity of the laser beam processing and punching is provided to the machine 1. The processing performance is improved by such method.


Inventors:
NAKAMURA RYUJI
Application Number:
JP1984000142227
Publication Date:
July 14, 1986
Filing Date:
July 11, 1984
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
AMADA CO LTD
International Classes:
B26D9/00; B23K26/10; B23K26/38; B23K26/382; B30B15/00; (IPC1-7): B23K26/00; B26D9/00
Domestic Patent References:
JPS5811318A1983-01-22



 
Previous Patent: JPS61154780

Next Patent: LASER WELDING METHOD