Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BORING/CUTTING COMPOUND MACHINING APPARATUS OF LONG MATERIAL
Document Type and Number:
Japanese Patent JP2005254361
Kind Code:
A
Abstract:

To provide a boring/cutting compound machining apparatus of a long material, performing boring and cutting at the same time.

This boring/cutting compound machining apparatus includes: a cutter 3 having transport conveyers 5F, 5R for supporting the long material W in the longitudinal direction as the transport direction and cutting the long material supported on the transport conveyer to short materials; and a drill head for boring. The apparatus is characterized in that a long material transport positioning device 39 having a feed material stock vice device 37 for freely holding the long material on the transport conveyer is provided to approach and separate from the cutter 3, and the long material transport positioning device is provided with the drill head for boring the long material.


Inventors:
SAKAI NORIHISA
Application Number:
JP2004066760A
Publication Date:
September 22, 2005
Filing Date:
March 10, 2004
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
AMADA CO LTD
International Classes:
B23B41/00; B23D23/00; B23D31/00; B23P23/02; (IPC1-7): B23D31/00; B23B41/00; B23D23/00; B23P23/02
Domestic Patent References:
JPH07108430A1995-04-25
JPH07314242A1995-12-05
JPH1029078A1998-02-03
JPH1034413A1998-02-10
JPH05154730A1993-06-22
JP2000202537A2000-07-25
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu



 
Previous Patent: IN-PIPE TREATING MACHINE OF BURIED PIPE

Next Patent: PAPER POST-PROCESSING DEVICE